Chief Scientist of Yangtze Memory Technologies: China's 3D Flash Memory Chip Technology Has Advanced from Lagging Behind to Catching Up
On July 6, it was reported that on the morning of July 3, Peking University held the 2025 Graduate Commencement Ceremony and Degree Awarding Ceremony. Huo Zongliang, alumnus of the Computer Science and Technology Department, Microelectronics major, class of 1994, and Ph.D. alumnus of the Microelectronics Department, class of 2000, served as an alumni representative to speak and offered blessings and valuable advice to the graduates.
Huo Zongliang stated that Peking University is closely linked to national rejuvenation and that graduates should choose to walk alongside the nation and share a common destiny with it, dedicating themselves to industries that the country needs.
Huo mentioned, "The blood of Peking University students flows with the genes of patriotism and global responsibility. By engaging in industries that the country needs, we can more easily realize our life's value. The storage industry was not the most popular sector at the time of my graduation, but I firmly believe it is an industry that the country needs. Therefore, what we must do is to settle down, not fear sitting on the sidelines, avoid seeking quick returns, and silently strive on the path of independent research and development."
Huo Zongliang expressed, "In the past decade at Yangtze Memory, our team has endured hardships and forged ahead, enabling China's 3D flash memory chip technology to develop from nothing to something, from lagging behind to catching up, achieving leapfrog development."
Yangtze Memory Technologies was established in July 2016 and is a domestic semiconductor integrated circuit company focused on 3D NAND flash memory and storage solutions. It offers products such as 3D NAND flash, embedded storage, mobile hard drives, solid-state drives, and launched the only retail storage brand, Zhi Tai, in 2021. In April 2020, Yangtze Memory announced the successful development of the third generation of TLC/QLC flash memory, with the X2-6070 model being the first third-generation QLC flash memory, boasting the highest I/O speed, storage density, and single-chip capacity in the industry at the time of its release.