This is all Minister Ashwini Vaishnav said about semiconductors in Davos summit -
1 - Timelines and Milestones:
>>First Fabrication Plant (Fab): Aiming to be operational by the end of 2026.
>>First Chip Production: Expected by August/September 2025 from one of the five semiconductor units currently under construction.
>>Technology Absorption: Focus on mastering 28-nanometer (nm) and above node technology, with plans to advance to higher nodes by 2026–2027.
2 - Expansion Plans:
>>Next Phase: Targeting investments in semiconductor equipment manufacturing and chemical/gas suppliers to establish local bases in India.
>>Chip Design: 25 products are in the design phase, emphasizing India’s focus on developing intellectual property (IP) domestically.
3 - Investment and Industry Confidence:
>>New Investments: The minister hinted at upcoming announcements but avoided speculating on amounts. When pressed, he declined to confirm figures like "$5–7 billion" stressing that details would follow finalized agreements.
>>Industry Support: Highlighted strong global interest during a semiconductor roundtable, with companies expressing confidence in India’s ecosystem.
4 - Strategic Goals:
>>Self-Reliance: Building a holistic semiconductor ecosystem, including design, fabrication, and supply chain (equipment/chemicals).
>>Job Creation & Innovation: Aligning with India’s talent pool and design capabilities to drive long-term growth.