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Canon and Nikon have DUV machines which can itch upto only 14nm node chips. The companies which are building fabs should evaluate machines from all the 3 companies ASML, Canon, and Nikon. Which one has low down time, less maintenance, cost of servicing, cost of replacing parts, cost to buy, yield on each wafer etc before deciding which one to buy. I hope they buy few from ASML and few from Canon as they would be familiar with working on both kinds of machines. We anyway need ASML machines beyond 14nm node since Canon and Nikon don't have EUV machines.
I don't think we will get EUV anyway. By the time in 15 years we gain experience in DUV upto 6nm, we probably won't be in good terms with US or suffering some kind of shadow embargo related to EUV.Canon and Nikon have DUV machines which can itch upto only 14nm node chips. The companies which are building fabs should evaluate machines from all the 3 companies ASML, Canon, and Nikon. Which one has low down time, less maintenance, cost of servicing, cost of replacing parts, cost to buy, yield on each wafer etc before deciding which one to buy. I hope they buy few from ASML and few from Canon as they would be familiar with working on both kinds of machines. We anyway need ASML machines beyond 14nm node since Canon and Nikon don't have EUV machines.
Canon and Nikon have DUV machines which can itch upto only 14nm node chips. The companies which are building fabs should evaluate machines from all the 3 companies ASML, Canon, and Nikon. Which one has low down time, less maintenance, cost of servicing, cost of replacing parts, cost to buy, yield on each wafer etc before deciding which one to buy. I hope they buy few from ASML and few from Canon as they would be familiar with working on both kinds of machines. We anyway need ASML machines beyond 14nm node since Canon and Nikon don't have EUV machines.